Data Center Thermal Analysis

What is IBM’s Data Center Thermal Analysis?
Are your organization struggling with rising data center cooling costs, reliability and availability risks posed by thermal problems and other data center cooling issues such as IT growth limitations and inefficiencies? IBM can help. Using Measurement & Management Technologies (MMT) and IBM’s experience from worldwide data center analysis engagements, a thermal profile of an existing data center can be created to identify possibilities for cooling efficiencies and smarter energy use.
The Measurement Survey and Analysis module uses 3D thermal maps for in-depth analysis and troubleshooting. This point-in-time measurement can help immediately fix cooling inefficiencies in the thermal envelope and extend the life of a data center.
To date, IBM has identified potential average energy savings of 12 percent of IT power costs and 23 percent of cooling power costs for data centers ranging from 3,000 to 85,000 square feet. For the savings obtained from the Measurement Survey and Analysis, payback has been achieved in 6 to 12 months, yielding a potential 100 percent return on investment after one year. Actual client results may vary.
Offering Value
Many factors and variables interact to affect the thermal profile of a data center. MMT uses a multi-level cart design and networked sensors to measure thousands of temperature and humidity data points. Tile by tile, the cart collects data into a 3D thermal map to help pinpoint trouble spots that indicate cooling inefficiencies. In-depth analysis of these trouble spots and other cooling metrics can lead to actionable corrective steps.

Typical project tasks
An MMT engagement can include:
- A 3D thermal scan of your data center with exclusive IBM Mobile Measurement Technology
- Analysis with temperature maps and potential energy savings opportunities
- Recommendations for how to achieve forecasted savings
- Planning, installation and verification of the real-time sensor network and software
- Training on the monitoring and management solution
- Ongoing support and analysis of real-time results to maintain and build on savings
Analysis can include:
- Rack Inlet Hotspots identifies IT equipment with the hottest inlet temperatures, locating under-cooled and over provisioned areas and those affected by recirculation of warm exhaust air.
- Data Center Air Flow measures airflow from computer room air conditioning units and through perforated tiles near rack inlets, targeting areas with low airflow possibly caused by under-floor blockages and restrictive perforated tiles.
- ACU Utilization calculates the ratio of the heat removed by an ACU to the nominal ACU heat removal capacity. It also identifies which ACUs can be turned off with the least impact.
- “What if?” scenarios can be studied when the Measurement and Management Technologies results are combined with the Data Center Thermal Analysis and Optimization service.
Ordering Information
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